Indian Institute of Technology Delhi (IIT Delhi) and Micron Technology, Inc have entered into a research partnership to improve semiconductor reliability through AI-driven modeling and electronic materials research. The project focuses on predicting and mitigating fatigue and fracture in copper-based electronic components used in semiconductor devices.
This initiative will be led by Prof. Souvik Chakraborty, Prof. Ritwik Bandyopadhyay and Prof. Md Rushdie Ibne Islam from IIT Delhi’s Department of Applied Mechanics. Their work will involve developing neural models and using advanced simulation techniques to understand material behavior. The collaboration is coordinated through IIT Delhi’s Corporate Relations office. It brings together academic knowledge and industry experience to address specific challenges in semiconductor design and performance.
Prof. Preeti Ranjan Panda, Dean of Corporate Relations at IIT Delhi stated that such partnerships help in generating practical outcomes from research. Dr. Gurtej S. Sandhu, Principal Fellow and Vice President at Micron Technology emphasized the role of collaborative efforts in building frameworks that support future innovation in semiconductor technologies. This joint research aims to contribute technical insights that can be applied in real-world semiconductor manufacturing and design processes, marking a step forward in industry-academia collaboration.
